Maintenance Free and Non Dismantling GTH Series Linear Module GTH5 Space-Saving
1
MOQ
200-700
prezzo
CaratteristicheGalleriaDescrizione di prodottoOra chiacchieri
Caratteristiche
Specificazioni
Accuratezza del posizionamento ripetibile (MM):± 0,01
Corso standard (mm):Intervallo 50-800 mm/50
Capacità motoria Servo AC (W):100
Diametro esterno a vite (mm):C7φ12
Accoppiamento (mm):7x8
Sensore di origine:PM-Y45 (NPN)
Informazioni di base
Luogo di origine:Cina
Marca:SXEGL
Certificazione:CE/FCC/EPA/RPSH/ISO
Numero di modello:GTH5
Termini di pagamento e spedizione
Imballaggi particolari:Cartone e schiuma
Tempi di consegna:5-14
Termini di pagamento:L/C, D/A, T/T, D/P, Western Union, MoneyGram
Capacità di alimentazione:Consegna in tutto il mondo
Galleria
Maintenance Free and Non Dismantling GTH Series Linear Module GTH5 Space-Saving
Descrizione di prodotto
Maintenance Free and Non Dismantling GTH Series Linear Module GTH5 Space-Saving
I. Product Introduction The GTH series is a track-embedded screw module, serving as a core transmission component for industrial precision automation. It covers a stroke range of 50-1350mm, is compatible with mainstream PLC control systems, and can be flexibly configured into multi-axis structures to meet diverse motion requirements.
II. Core Advantages It features ±0.01mm repetitive positioning accuracy and a maximum operating speed of 2000mm/s. The integrated track design improves straightness by 40%, with a maximum thrust of 2563N and horizontal load capacity up to 120kg. It boasts strong rigidity and remains stable even at high speeds.
III. Key Selling Points 20% narrower than traditional modules, saving installation space; achieving CLASS 1 cleanliness with low particle generation; external oiling enables maintenance without disassembly, reducing downtime; equipped with collision detection for reliable safety protection; datum plane + positioning PIN hole design allows easy installation and calibration.
IV. Application Fields In the semiconductor field, it is used for wafer handling; in the new energy field, it adapts to battery pole piece lamination; in electronic manufacturing, it facilitates SMT placement; in biotechnology scenarios, it supports sample transfer, covering key links in high-end manufacturing.